GOOT soldering wick dipper for bga rework

1)mesh unsolder, 2)hard disk for iphone 3gs 3)Easy to use desolder braid, easy to Solde 4Made of copper materials 51.5mm/r

 

Company profile : Shenzhen Jufeng Solder Co.,Ltd is an enterprise specializing the development, production and selling of the soldering tin materials and related chemical products, and its products have been issued with ISO9001:2008 .The company always attaches importance to the R&D of technology and the improvement of quality,has its scientific research institutin,and has gathered a set of senior technicians and managers and established strict management system and perfect quality guarantee system. Product decription:Solder wick is one special maintenance tools it greatly reduces the appearance of electronic product rework/repair time, especially for our notebook, mainboard chipset and occurrence of BGA do card such as CPU chip to have the help very much. And dramatically reduce the risk of injury caused by hot board.

Made of copper materials

model: 1515 / 2515 / 3015 / 3015 size

Length: 1.5m

Wide:3mm

 

 

Use graphical:

 

1) Please look at the circuit board on the left side of the two spot.. Wait a minute demonstration will clean solder joints

2) Use method is very simple.. Suction tin line pressure in the solder joints, then soldering iron to pressure up

 

3) See ~ ~ tin their suction came up

 

4) . After absorption not clean appearance.. I have been very clean.. Take alcohol brush line!!!!! 

 

 

 

 

 

 

 

 

Model and chemical content of lead-free solder bar
Model Chemical content,%   Sn Ag Sb Bi Cu Pb Zn Fe Al As Cd Sn99.95 99.96   <0.014 <0.006 <0.008 <0.05 <0.002 <0.02 <0.002 <0.03 <0.002 SnCu0.7 Remain <0.05 <0.05 <0.01 0.7 <0.05 <0.002 <0.02 <0.002 <0.03 <0.002 SnAg3.5 Remain 3.5 <0.12 <0.05 <0.05 <0.05 <0.002 <0.02 <0.002 <0.03 <0.002 SnAg3.0Cu0.5Sp Remain 3.0 <0.12 <0.1 0.5 <0.05 <0.002 <0.02 <0.002 <0.03 <0.002 SnAg3.5Cu0.7Sp Remain 3.5 <0.1 <0.1 0.7 <0.05 <0.002 <0.02 <0.002 <0.03 <0.002 SnAg3.9Cu0.6Sp Remain 3.9 <0.1 <0.1 0.6 <0.05 <0.002 <0.02 <0.002 <0.03 <0.002 SnAg3.8Cu0.7Sp Remain 3.8 <0.1 <0.1 0.7 <0.05 <0.002 <0.02 <0.002 <0.03 <0.002
Common solder bar	Product picture
Black Cat Solder Bar adopts extruded process, before extrusion, the ingot processed by end cropping, peeling off the surface, it has the advantage of less residue, dense physical structure, rapid melting, less residue. Black Cat solder bar is widely used in high-class soldering and other domain.Application of products:Solder bar for wave-soldering;Solder bar for dip soldering;Solder bar for auto water tank;Solder bar for industry electroplating.

 After Auction Close, you can go ahead and checkout with bank system, We do not offer combine payment and discount, since items might dispatch from our different warehouse. Make sure you file correct shipping address during checkout, and you will be guid to Payment link. You will be able to pay through our bank account by 100%T/T advanced.

 

Items will be shipped within 48 hours after get your payment (except Saturday and Sunday).-Please contact with us if didn't receive them after 9 days. Thanks!-We ONLY ship to the confirmed address provided by customer confirmed. Before you pay, please make sure your info you would like us to ship to.

  A ‘No Clean’ type paste is designed for soldering SMD components in production processes that do not include washing phase. Apart from metals powders, the product composition includes resin based and solvent based flux, activators that remove oxides and thixotropic additions, responsible for viscosity and plasticity. The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature. 

2015 solder wick